TPR Systems Additive I
TPR Systems Additive I is a polyisocyanate based methacrylic resin. It is a constituent of the urethane-modified reactive resins TPR Systems RU 727 and RU 747. To bind surface moisture and on slightly moist substrates, a proportion of 10 – 15 % pbw. of TPR Systems Additive I can be added to the primer resin TPR Systems R 51. Read more …
TPR Systems Additive M
TPR Systems Additive M is a bonding enhancer for ceramic and other poorly absorbent substrates. It can also be used at joins to metal and when working over small areas of metal substrates. Additive M is employed solely in combination with the urethane modified reactive resin TPR Systems RU 727. Read more …
TPR Systems Additive ZA
TPR Systems Additive ZA supports the low-temperature hardening of methacrylic based TPR reactive resins in combination with dibenzyl peroxide as hardener in the temperature range from +5 °C to -25 °C. Read more …
TPR Systems RI/21
TPR Systems RI/21 is a quick-hardening, 2-component methacrylic-based adhesive. It was developed specifically for bonding steel to concrete substrates. Read more …
TPR Systems Hardening Powder
The manufacture of polymers through the interlinking of many small molecules is known as polymerisation (hardening). This hardening mechanism is triggered by the addition of a TPR Systems Hardening Powder. Read more …